News archive
Press releases
Atotech wins distinction as a Top Employer 2019 in Germany || Corporate
Atotech has once again earned a Top Employer award in Germany, which is awarded annually by the Top Employers Institute. In conferring the award, the institute again acknowledged and confirmed Atotech’s continuous focus of its people strategy.
Atotech to present a series of new processes at the IPC APEX Expo 2019 || Electronics
Atotech to present a new high-throw e’less Cu bath, through-hole, BMV filling, and conformal plating electrolyte, and its revolutionary ENIG final finish at the IPC APEX Expo 2019.
A new series of panel level plating processes and equipment for high resolution pattern plating || Electronics
Atotech to present its new series of panel level plating processes and equipment for high resolution pattern plating during NEPCON Japan 2019.
Atotech at the Electronics Packaging Technology Conference 2018 || Electronics
Atotech will introduce a new SAP copper electrolyte which allows for higher current densities while still keeping very good copper thickness within unit distribution (WUD) results.
Atotech to present at SEMICON Europa and electronica 2018 || Electronics
Atotech’s product experts will be present at booth 569 in Hall A4 to discuss latest technology, trends, and future requirements.
Atotech to exhibit and present at TPCA Show and IMPACT Conference 2018 || Electronics
Atotech will present “Filling of Microvias and Through Holes by Electrolytic Copper Plating – Current Status and Future Outlook”.
Atotech’s Surface Finish specialist Rick Nichols at this year’s SMTA International 2018 || Electronics
Atotech invites all conference visitors to join the talks and meet Rick Nichols to discuss these and other current product highlights.
Reducing manufacturing costs on Fan-Out Panel-Level Packaging (FO-PLP) || Electronics
Atotech specialists will speak at the iMAPS on several current topics such as recent developments and solutions for Panel-Level Packaging.
The next revolution in electroless copper for advanced FPCB || Electronics
Atotech introduces a new horizontal electroless copper process specifically developed to ensure a blister-free electroless copper deposition and shiny surface appearance after electrolytic copper plating.
香蕉视频 for a SMART world – Atotech to present and exhibit at the 38th IEMT conference || Electronics
Atotech today announced that it will participate in the 38th International Electronics Manufacturing Technology (IEMT) Conference 2018.
Tradeshows and events
productronica and Semicon Europa 2017 || Munich, Germany
Atotech presents next generation technologies for smart phones, aerospace and automotive at the productronica and Semicon Europa 2017 in Munich.
TPCA 2017 || Taipei, Taiwan
Atotech presents next generation HDI technologies using (advanced) modified semi-additive processing (amSAP/mSAP) for smartphone applications at the TPCA Show 2017 in Taipei.
Pro SF 2017 || Shanghai, China
Atotech will be participating in the International Surface Finishing Exhibition 2017, presenting most innovative solutions.
SAE Brake Colloquium & Exhibition || Orlando, USA
For years, the SAE Brake Colloquium has been the perfect place to obtain the most critical and up-to-date information on braking and brake systems for OE/aftermarket customers and end users.
ZVO Oberfl?chentage 2017 || Berlin, Germany
From September 13 – 15, the ZVO congress (ZVO Oberfl?chentage) is taking place in the German capital Berlin. Atotech is a proud sponsor of the event and will be present with a booth.
Automotive Manufacturing 2017 || Bangkok, Thailand
From June 21 – 24, 2017, Atotech presents next generation surface finishing technologies for decorative and functional applications at the Automotive Manufacturing 2017 in Bangkok.
SURFIN || Atlanta, USA
Atotech looks forward to this year’s SUR/FIN. Our SURface FINishing experts. will introduce you to the latest state-of-the-art technologies, and discuss current and upcoming market requirements, as well as technology trends.
JPCA Show 2017 || Tokyo, Japan
Atotech will introduce NovaBond? IT, its new and innovative non-etching adhesion promoter for IC Substrates and high frequency application inner-layer bonding and soldermask pretreatment, to press and media at this year’s JPCA Show Press Forum.
C-Tex 华东电路板暨表面贴装展览会 || 中国苏州
安美特展示了新一代先进贬顿滨湿流程及系统方案
ECTC 2017 || Lake Buena Vista, FL, 美国
安美特展示了FO-Panel Level Packaging (FO-PLP) 新一代电镀技术