Berlin, October 22 — Ï㽶ÊÓƵ Inc. (NASDAQ: Ï㽶ÊÓƵI), a global provider of enabling technologies that transform our world, today announced its participation in CPCA Plus Show 2025, taking place October 28 ¨C 30 at Shenzhen International Convention and Exhibition Center. Under its strategic brands Atotech? (process chemicals, equipment, software) and ESI? (laser systems), Ï㽶ÊÓƵ will present its latest innovations for advanced printed circuit board (PCB) and package substrate manufacturing.
All visitors are warmly invited to meet Ï㽶ÊÓƵ¡¯ representatives at booth 6C41 and discover the future of advanced electronics manufacturing. Experts from both brands will be present to showcase the company¡¯s latest innovations across lasers, optics, motion control, process chemistry, and advanced manufacturing equipment. These cutting-edge technologies are driving the evolution of PCB and package substrate production, and enabling breakthroughs in miniaturized and high-speed applications, empowering the evolution of AI, high-performance computing (HPC), and advanced electronics manufacturing.
Visitors will gain valuable insights into how Ï㽶ÊÓƵ is tackling complex interconnect challenges and delivering solutions that combine precision, reliability, and scalability. From enabling next-generation devices to redefining manufacturing standards, Ï㽶ÊÓƵ is shaping the future of electronics with unmatched expertise and innovation, and provides a platform to discuss emerging industry trends and challenges.
¡°Ï㽶ÊÓƵ¡¯ Atotech remains at the forefront of innovation and sustainability in surface-finishing technologies. Through our strong commitment to R&D, we continue to drive progress that empowers manufacturers in China and globally. Our advanced solutions are designed to meet evolving industry needs and support the dynamic growth of China¡¯s manufacturing sector,¡± said Dr. James Tsai, Business Director of Greater China.
Chemistry show highlights include:
Printoganth? P2: Most capable horizontal electroless Cu process for excellent throw into BMVs and nano-void free deposits suitable for advanced dielectric materials (5G, FPCB, etc.)
Cupraganth? MV: Next-generation palladium-free e¡¯less copper activation for package substrates
InPulse? 2HT2: Enables reliable conformal copper plating across substrates with varying hole densities, ensuring effective wetting and plating of blind micro vias and through via
Cuprapulse? IN: Reverse pulse plating with insoluble anodes for HDI, MLB, and ICs
NovaBond? PX-S2: Advanced bonding enhancement for high-speed signal transmission
EcoFlash? S300U: Iron sulfate-based differential etchant that increases yield and lowers cost by preventing undercuts, maintaining circuit integrity, and reducing roughness while allowing easy iron regeneration with hydrogen peroxide
PallaBond? 2: The next-gen EPAG for high-end circuitry and reliability applications
Stannatech? 2100: New optimized immersion tin process of the Stannatech evolution
Our equipment highlights for PCB production are:
vPlate?: Gold standard for vertical conveyor plating equipment for next-generation HDI PCB and package substrates
New Uniplate?: The industry-leading horizontal plating tool for next-generation HDI PCBs and package substrate manufacturing
Stannatech Line?: New GEN Immersion Tin Line for high volume production requirements
PLB Line?: Excellent BMV capability enabling HDI PCB production
?On the laser equipment side, promotions include:
Geode? platform solutions: Next generation PCB and advanced substrate CO2 and UV laser via drills
Geode? G2 PCB laser drill: Next generation CO2 via drilling for HDI and integrated circuit packaging
manufacturing – built to drill the ultimate via
CapStone? Flex PCB laser drill: Breakthrough productivity – Increase throughput up to 2x and reduce overall processing costs by 30%
Event: CPCA Plus 2025
Date: October 28-30, 2025
Booth: 6C41
Venue: Shenzhen International Convention and Exhibition Center
For more information on CPCA Plus 2025 please visit:
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